That is to say, the digital-to-analog undivided way can only be used when the analog circuit area is far away from the digital circuit area that generates large noise.
The dielectric constant of substrates and prepreg materials using epoxy glass can be controlled by changing the percentage of resin content.
The resistance value of the terminal resistance should match the characteristic impedance of the line. This can be done manually or by CAD tools to calculate the characteristic impedance value and the terminal matching resistance value.
In the actual study, we can conclude that there are four main interference, including power supply noise, transmission line interference, coupling and electromagnetic interference (EMI). Through analyzing various interference problems of high frequency PC
Spray tin is divided into lead spray tin (i.e. hot air flat) and lead-free spray tin. Below you can see the difference between the various processes;
Many customers use pad(plug-in holes) to represent conductive holes, thus causing your conductive holes to open the window. Then please check your document design! At this point in time,
Radio-frequency radiation is a combination of this magnetic and electric field. Magnetic and electric fields leave the PCB structure by means of radiation or conduction.
In PCB, EMI can be produced for many reasons, such as: RF current, common mode level, ground loop, impedance mismatch, magnetic flux
In addition, with the increase of width, PCB current-carrying capacity does not increase strictly in line with the linear increase
Any circuit board material used in millimeter-wave circuits should have a low TCDk value to minimize the impact of Dk changes on circuit performance (such as phase shift).
the thermal performance index analysis software module added in some professional PCB design software can help designers optimize circuit design.
there are still some differences between high frequency products and high speed products in the demand for plate.
