The following is a calculation example of the position accuracy of the intermediate component of PCB board in the following two positions (the position accuracy calculation of the length direction is only taken as an example, and the width direction is no
In the process of high-speed circuit design, we must consider how to deal with the radiation of the power supply and the interference to the whole system. Generally, the area of the power layer plane should be smaller than the area of the ground plane, so
PCB design based on PCB design software can also be regarded as a software development process. Software engineering pays most attention to the idea of "iterative development" to reduce the probability of PCB errors.
sinking gold plate and gold plate is the same process product, electric gold plate and flash gold plate is the same process product, in fact, it is just different people in the PCB industry of different names, sinking gold plate and electric gold plate is
The depth of the holes usually does not exceed a certain ratio (aperture). Buried holes are connection holes located in the inner layer of the PCB that do not extend to the surface of the PCB.
In addition, in winter, when the tank liquid in some factories is not heated, special attention should be paid to the live into the tank of the production process, especially the plating tank with air stirring, such as copper nickel
The correct detection, measurement and analysis of "burst" mode wireless signal is a very meaningful work for SI design.
It is impossible to predict exactly where PCB surface treatment technology will go in the future. Anyway, to meet customer requirements and protect the environment must be done first!
It can be seen that the coordination between welding aid and welding resistance pad design plays a decisive role in improving PCBA manufacturability and welding pass-through rate.
There is no limit to the number of layers of multilayer boards. At present, there are more than 100 layers of PCB, and the common ones are four and six layers of boards.
In particular, it should be noted that the bypass capacitor needs to pass through two holes when connecting the power layer to the formation, so that the parasitic inductance of the hole will be multiplied.
Compared with the dip welding process, the motion of solder solution and PCB board in the drag welding process makes the thermal conversion efficiency better than that in the dip welding process.
