How to ensure the quality of the patch: 1. Strict SOP production process control; 2. Professional technical team; 3. Complete incoming material inspection and confirmation process; check PCB and materials; 4. PCBA new machine type production project team;
Measures to reduce the tin residue of PCBA tin beads: 1, attach importance to the production of steel mesh, combined with the specific component layout of PCBA board, appropriately adjust the size of the opening, so as to control the printing amount, 2, b
How does PCBA improve product quality: (1) strengthen routine maintenance of machines, (2) requirements for equipment operators, and (3) develop measures to reduce or avoid errors
Learn about the factors that affect the appearance quality of the solder choke：1, printing: photoresistance welding ink screen printing process, blade flatness, environmental purification, screen printing using barrier tape and ink printing pressure will
First, according to the use effect to judge the quality of smt red glue two, according to the welding situation to see smt red glue, three, according to the word of mouth to judge smt red glue, and the best way is to try
How to choose SMT patch processing machine: first, accuracy, second, stability, third, durability, fourth, easy maintenance
How to ensure the quality of PCB processing: one: pressure (patch height) - patch pressure (height) should be appropriate, two: correct components - required assembly position number, three: accurate position - the end or pin of the components and pad gra
Usually the same area, the more PCB layers, the more expensive the price. The design engineer should use as few layers as possible to complete the PCB design while ensuring the quality of the design signal.
It is critical for board designers to lay out their boards to create the best possible signal and power integrity. Components shall be placed in a good position for short and direct wiring. At the same time, the boards must be laid out so that all the net
Next, I will introduce the research and development process of PCBA products.1. Market research; 2. Prototype and interaction design; 3. Hardware development - main chip confirmation
The basic working conditions of PCBA patch after processing are as follows: 1. Working conditions: Temperature: 18℃ to 28℃, humidity: 35% ~ 75%; 2. 2. Operation object: all PCbas; 3. Operator: with certain general SMT and DIP welding status identification
As an important part of PCBA, SMT processing has a direct impact on product quality. SMT processing includes multiple processes. How to standardize each process so as to post perfect PCBA
