Test tools and red glue process used in SMT

Test tools and red glue process used in SMT
SMT mounting processing is a relatively complex process with strict requirements for operators Even if you are an experienced technician, you may make mistakes In this case, we need to constantly use relevant tools and equipment for testing; What devices can be used and in which link; Today we will share which testing tools will be used for SMT patch processing
1. MVI detection method. In fact, this is a testing method that completely depends on experience. It requires high technical personnel. It is usually called manual visual inspection. Some technical problems can also be seen with the eyes.
SMT wafer processing
2AOI detection method. This detection method is mainly used in the production line and can be used in many parts of the production line. Of course, detection is mainly used for the operation of various defects.

We can place the equipment in the place prone to defects at an early stage, so that AOI can be used to find and deal with problems in a timely manner If some parts are missing or redundant related parts exist, they need to be cleaned in time
3. X-ray testing. This kind of detection detects the problems that are easy to occur on the circuit board. In SMT chip processing, the solder joints on many circuits need very high technical personnel. For example, for solder joints that cannot be seen clearly by the naked eye or are prone to problems, we can use BGA to solve them. After welding, there may be voids or inconsistencies in the size of solder joints, which need to be checked later to solve. Of course, some ICT auxiliary test equipment may be used later.
Red glue process and process flow of STM chip processing
In STM patch processing, red glue process is a common basic processing technology PCBA proofreading Many SMT chip processing production processes will use this processing technology Red glue is actually red or yellowish white Binders are mixtures of hardeners, pigments, solvents and other materials
PCBA processing, STM chip processing
The red glue processing technology of SMD is to use the thermal curing characteristics of red glue. It is filled in the middle of two pads through a printing machine or distributor, and then cured and welded through repair welding and reflow welding. Finally, the surface is wave welded. The installation side passes through the wave crest, and the welding process is completed without clamps. The processing flow of OEM materials and the role of red glue.
1. Red glue processing flow
1. The ordering customer selects the chip processing factory to place an order according to the actual needs, provides the required processing requirements, and puts forward specific requirements to the manufacturer.
2. Provide information After deciding to place an order, the customer will provide a series of files and lists, such as PCB electronic files, coordinate files and BOM lists required for production.
Purchasing raw materials One stop PCBA manufacturers purchase relevant raw materials from designated suppliers according to the BOM information provided by customers.
4. The incoming material inspection shall strictly inspect the quality of all raw materials used to ensure that they are qualified before being put into production.
5. PCBA processing is carried out in strict accordance with electronic processing standards.
6. The PCB testing factory carries out strict product testing, and the qualified PCB boards are delivered to the customer.
After the packaging and shipping PCBA processing is completed, the product will be packaged and delivered to the customer to complete the whole PCBA processing.
2. Function of red glue:
1. The use of red glue during wave soldering in electronic processing can prevent components from falling during transmission.
2. Prevent the rear parts of the vehicle from being damaged and the double-sided patch from falling off during reflow welding
3. Prevent displacement and standing during installation during reflow welding and precoating.