SMT patch component stele causes and solutions
Factors affecting the printing thickness of solder paste: reduce the thickness of steel mesh plate, ...
Factors affecting the printing thickness of solder paste: reduce the thickness of steel mesh plate, ...
General circuit board production will be carried out board work, its purpose is to increase the prod...
According to the activity of flux, it can be divided into active (RA), medium active (RMA), inactive...
SMT technology has only a history of more than 40 years. It has gone through the journey from birth,...
In the SMT process, there are six mounting quality problems that need attention: 1, mount design qua...
5 PCBA processing automation production of PCB size, shape, transmission edge, positioning hole, pos...
◆ Main factors affecting the viscosity of solder paste: 1. Shape and temperature, 2. Thixotropic coe...
In the process of electronic machining, the smaller the Angle of the scraper affects the vertical fo...
Component layout shall be designed according to SMT electronic processing production equipment and p...
The quality of reflow welding is affected by many factors, the most important factor is the temperat...
The cleaning quality detection methods of PCBA are as follows: 1. Test methods of ion pollutants: (1...
Significance of PCB cleaning after surface mounting welding: 1. PCB cleaning after surface mounting ...