The technical requirements of high speed and high frequency copper clad plate for 5G communication
Thin substrate material should be selected for 5G high-frequency plate. Meanwhile, material characte...
Thin substrate material should be selected for 5G high-frequency plate. Meanwhile, material characte...
This paper introduces various techniques of the three types of interconnect design, including device...
In order to alleviate this design pressure, communication chip manufacturers have to choose to devel...
With the development of the electronic industry, the integration degree of electronic components is ...
The production process of high frequency and high speed PCB board is basically the same as that of o...
The reasonable selection of printed board size can make full use of the intermediate layer to set th...
A standard PCB looks something like this. Bare Board (with no parts attached) is also often referred...
The development level of printed circuit board industry can reflect the development speed and techni...
PCB board selection must meet the design requirements, mass production, cost balance. In short, the ...
With the "copper plating" process put into use, our company's various production lines hav...
No matter what work you are engaged in in the circuit board industry, if the circuit principle of el...
The choice of surface treatment process mainly depends on the type of final assembly components; The...