How to program placement on a placement machine
1 Edit the optimized product program SMT placement machine on
1. Call up the optimized program.
2. Make PCB marks and some Mak images.
3. Make images for the components that are not imaged and register them in the image library.
4. Register unregistered components in the component library.
5. For the multi tube vibrating feeder with unreasonable discharge, it shall be redistributed according to the length of the device body, and the devices with relatively short length of the device body shall be arranged on the same frame as far as possible: grasp the material station, and try not to have an idle material station in the middle, so as to shorten the distance between the picking parts.
Circuit board
6. Change the multi pin, narrow pitch equipment with large contour in the program, such as 160 multi pin QFP, large size PLCC, BGA and long slot, to single pickup, which can improve the pickup method. Installation accuracy.
7. Save to the disk, check whether there is an error message, and modify the program according to the error message until there is no error message after saving.
2. Proofread check and backup patches
1. According to the component list in the PCBA process file, check whether the component name, label, model and specification of each step in the program are correct, and correct the incorrect part according to the process file.
2. Check whether the components on each feeder station of the mounter are consistent with the picking program table.
3. Use the main camera on the mounter to check whether the X and Y coordinates of the components in each step are consistent with the component center on the PCB. Check the corner according to the element location diagram in the process file Whether it is correct and correct the error. (If this step is not performed, it can be corrected according to the actual placement deviation after placing the first SMT)
4. Copy the correct product program to the backup USB flash drive and save it.
6. Production can only be carried out after checking and checking.
Reasons for low placement efficiency of placement machine
1. The suction nozzle of the placement machine is located at the smt patch. On the one hand, the vacuum negative pressure is insufficient for processing, or, before picking up parts during placement, the suction pipe of the placement machine automatically switches the mechanical valve on the placement head, and the blow is converted into real, which absorbs and generates a certain negative pressure When the negative pressure sensor detects a value within a certain range after the suction of parts, the machine is normal, otherwise the suction is poor On the one hand, it is the pressure reducing valve of the air source circuit, such as the aging and rupture of the rubber gas pipe, the aging and wear of the seals, and the wear of the suction nozzle after long-term use On the other hand, a large amount of waste generated by adhesives or dust in the external environment, especially the cut parts packaged with woven paper, will cause the suction nozzle of the mounter to be blocked 2. Errors in the placement machine program settings will also reduce the placement efficiency of the placement machine The solution is to add the training of patch machine manufacturers, so that customers can start faster Thus, the technical personnel of SMT chip processing plant are improved
3. The quality of the electronic components, the placement of the suction nozzle receiving electronic components, and even the plug of the mounter are not completely connected or directly bent or broken In this case, the quality of purchased and installed components can only be well controlled This will not only affect the installation efficiency and product quality The suction nozzle usually picks up and installs such components, which can also cause varying degrees of damage, As time goes on, the service life of the nozzle will be shortened Therefore, the regular maintenance of machinery and equipment SMT patch processing is a very critical link