How should BGA handle PCB fabrication in CAM fabrication?

How should BGA handle PCB fabrication in CAM fabrication?

PCB manufacturing, PCB design and PCBA processing manufacturers will explain to you how BGA should handle PCB manufacturing in CAM manufacturing?

1、 Fabrication at outer line BGA:

Before processing the customer's data, we should fully understand the specification of BGA, the size of the pad designed by the customer, the array, the size of the via under BGA, the distance from the hole to the BGA pad, and PCB boards with a copper thickness of 1~1.5 ounces. Except that the production of specific customers should be compensated according to their acceptance requirements, other customers should generally compensate for 2 mils if they use the mask etching process in production, and 2.5 mils if they use the graphic technology, The specification of 31.5mil BGA is not processed by graphic electric process; When the distance between BGA and vias designed by customers is less than 8.5mil, and the lower vias of BGA are not centered, the following methods can be used:

A standard BGA array can be made according to the BGA specification and design pad size corresponding to the BGA position designed by the customer, and then the BGA and BGA lower vias to be corrected can be photographed based on the BGA specification and design pad size. After being photographed, the effect before and after the snapshot should be checked by comparing with the original backup level before the snapshot. If the BGA pad has a large deviation before and after the snapshot, it cannot be used, and only the position of BGA lower vias should be photographed.

2、 BGA resistance welding production:

1. BGA surface mount solder mask opening: as the solder mask optimization value, the single side opening range is 1.25~3mil, and the distance between solder mask lines (or via pads) is no less than 1.5ml;

2. Treatment of BGA plug hole template layer and base plate layer:

① Make 2MM layer: copy the BGA pad of the circuit layer as another layer of 2MM layer and treat it as a square in the range of 2MM. No blank or gap is allowed in the middle of 2MM (if the customer requires that the character box at BGA be used as the plug hole range, the character box at BGA be used as the 2MM range for the same treatment). After the 2MM entity is made, compare it with the character box at BGA of the character layer, and the larger one is the 2MM layer.

② Plug hole layer (JOB. bga): touch the 2MM layer with the hole layer (select from the 2MM layer with the Actions à reference selection function in the panel), select Touch for the parameter Mode, copy the holes to be plugged within the BGA 2MM range to the plug hole layer, and name it JOB Bga.

③ Copy the plug hole layer as another base plate layer (JOB. sdb).

④ Adjust the hole diameter of the plug hole layer and the hole diameter of the base plate layer according to the BGA plug hole file.

3、 Processing of BGA corresponding hole blocking layer and character layer:

① Where the hole plugging is required, there is no stop point on both sides of the hole plugging layer;

② The white oil is allowed to enter the hole where the character layer is opposite to the plug hole.

After the above steps are completed, the board production of BGA CAM is completed. This is just the current situation of the board production of BGA CAM. In fact, due to the rapid change of electronic information products and the fierce competition in the PCB industry, the production procedures for BGA plug holes are often replaced, and new breakthroughs are constantly emerging. Every time this breakthrough makes the product go to a higher level and adapt to the requirements of market changes. We look forward to more superior BGA plug hole or other processes. PCB manufacturing, PCB design and PCBA processing manufacturers will explain to you how BGA should handle PCB manufacturing in CAM manufacturing?