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PCB Manufacturer: Some SMT component knowledge you do not know
11-302022
Andy 0 Замечания

PCB Manufacturer: Some SMT component knowledge you do not know

PCB Manufacturer: Some SMT component knowledge you do not know


PCB manufacturers, PCB designers and PCBA manufacturers explain some SMT component knowledge that you do not know


SMT components generally include SMC (surface mount components), SMD (surface mount components) and electromechanical components (switches, relays, etc.). Among them, SMC is a passive component, SMD is an active component, electromechanical components are special-shaped components, and it is worth noting that diodes and triodes are active components. Although SMT devices are small in size and some have no pins, SMD assembly density is very high. Do you want to know how many electrodes can be packaged in general SMT integrated chips? The minimum pin spacing of current SMT devices is 0.3mm, while the number of encapsulated electrodes can range from tens to thousands, typically QF


PCBA



SMT components generally include SMC (surface mount components), SMD (surface mount components) and electromechanical components (switches, relays, etc.). Among them, SMC is a passive component, SMD is an active component, electromechanical components are special-shaped components, and it is worth noting that diodes and triodes are active components.


SMT components

Although SMT devices are small in size and some have no pins, SMD assembly density is very high. Do you want to know how many electrodes can be packaged in general SMT integrated chips?


The minimum pin spacing of current SMT devices is 0.3mm, and the number of electrodes packaged can range from tens to thousands. Typical QFP packages and BGA packages. The minimum number of electrode pins of QFP package chips is 20, the maximum number may be more than 300, and the maximum number of BGA package chips can be up to thousands. For example, there are 208 pins in a 31mm * 31mm QFP-208 with a pin spacing of 0.5mm. When the pin spacing of 31mm * 31mmR BGA is 1.5mm, there are 400 solder balls (I/O); When the pin spacing is 1.0mm, there are 900 solder balls (I/O).


PCB manufacturers, PCB designers and PCBA manufacturers explain some SMT component knowledge that you do not know.

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