What are the problems with PCB laminates? How to solve it?

Here are some of the most commonly encountered PCB laminate problems and how to confirm them. Once a PCB laminate problem is encountered, it should be considered to add to the PCB laminate material specification.

1. There should be a reasonable direction:

For example, input/output, AC/DC, strong/weak signals, high frequency/low frequency, high voltage/low pressure, etc., their direction should be linear (or separate), shall not blend with each other. The aim is to prevent mutual interference. The best path is a straight line, but this is not easy to achieve. The worst path is a ring. Fortunately, isolation can bring improvement. For DC, small signal, low voltage PCB board design requirements can be lower. So "reasonable" is relative.

2, choose a good ground point:

Small ground point I do not know how many engineering and technical personnel have done much discussion on it, it shows its importance. In general, common points are required, such as: multiple ground wires of the forward amplifier should be joined and then connected with the main line, and so on. In reality, it is difficult to do this completely due to various restrictions, but you should try to follow it. The problem is quite flexible in practice. Everyone has their own set of solutions. If can be specific to the circuit board to explain it is easy to understand.

3. Reasonable arrangement of power filter/decoupling capacitor:

Generally, only a number of power filter/decoupling capacitors are drawn in the schematic diagram, but it is not indicated where they should be connected. In fact, these capacitors are used for switching devices or other components that need filtering/decoupling. The placement of these capacitors should be as close to these components as possible. Too far away will not be useful. Interestingly, when the power filter/decoupling capacitors are properly arranged, the ground point problem becomes less obvious.

4, the line is exquisite:

Conditional to do wide line never do fine; High pressure and high frequency line should be smooth, no sharp chamfering, turning shall not use right angles. Ground should be as wide as possible, the best use of large areas of copper, this docking site problem has considerable improvement.

Although some problems occur in the post-production, but it is the PCB design, they are: through the hole too much, the copper sinking process is a little wrong will bury the hidden trouble. Therefore, the design should minimize the hole through the line. The density of parallel lines in the same direction is too high, and it is easy to join together when welding. Therefore, the linear density should be determined according to the level of welding process. The distance of solder joint is too small, is not conducive to manual welding, can only reduce the efficiency to solve the welding quality. Otherwise, there will be hidden dangers. Therefore, the determination of the minimum distance of solder joint should consider the quality and efficiency of welding personnel. The size of the pad or wire hole is too small, or the size of the pad is improperly matched with the size of the drilling hole. The former is unfavorable to manual drilling, while the latter is unfavorable to CNC drilling. Easy to drill the pad into a "c" shape, heavy drill off the pad. The wire is too thin, and the large area of unwired area is not set up copper, easy to cause uneven corrosion. That is, when the unwired area is corroded, the fine wire is likely to corrode too much, or seem to break, or break completely. Therefore, the role of setting copper is not only to increase the ground area and anti-interference.